Pulsar Photonics RDX 500
Pre-owned UKP laser processing station · 532 nm · 10 ps · < 20 W · Galvo + F-Theta · CAD/CAM
Key Technical Data
| Laser Type | Ultra-short pulse laser (USP / Picosecond) |
|---|---|
| Pulse Duration | 10 ps upgradeable (module swap) |
| Wavelength | 532 nm |
| Average Power | < 20 W upgradeable (module swap) |
| Repetition Rate | 100 kHz – 20 MHz upgradeable (module swap) |
| Laser Serial Number | SN0702 |
| Machine Serial Number | RDX-500-071501 |
| Design | Modular – laser source, galvanometer scanner and axis system exchangeable; accuracy and laser parameters therefore upgradeable |
| Processing Axes | 2.5 axes (X/Y processing + Z-axis for focus/depth adjustment) |
| Repeatability XY Table | approx. ±20 µm over 300 mm (unconfirmed) upgradeable (module swap) |
| Scanner Unit | 2D galvanometer scanner with Newson rhothor™ Controller A2G_CUA01 incl. F-Theta objective; optical scan range 800 mrad |
| Processing Area | Min. 210 mm × 290 mm (exact dimensions to be specified) |
| Control Software | Windows 7 with Photonic Elements (scanner, camera, laser, axes control; CAD-CAM import, live view) and Rhinoceros 5.0 incl. PhotonicVectors plugin for job preparation |
| CAM Software | Rhinoceros 5.0 incl. PhotonicVectors plugin |
| Voltage / Electrical Power | 400 V, 5.8 kW |
| Dimensions (L×W×H) | 1,500 × 1,200 × 1,850 mm |
| Transport Note | The system likely fits through a 1.0 m wide door when partially disassembled. |
| Weight | approx. 750 kg |
| Laser Class | Safety class 1 |
Available Documents
Scope of Delivery
- Laser system Pulsar Photonics RDX 500 (base machine)
- Laser source EdgeWave PX25-2
- Control PC with software
- 2D galvanometer scanner unit with Newson scanner controller A2G_CUA01 incl. F-Theta objective
- Pulsar Photonics Camera Module CM-R1 for workpiece positioning
- Camera-based measurement function (for position and reference measurement)
- 1 tool parameter set for ITO thin-film ablation
- 1 tool parameter set for glass cutting
- Additional tool parameter sets can be developed on request
- Exhaust/suction device for ablation particles
- Vacuum chuck with vacuum pump for flat sample fixation
- CAM software: Rhinoceros 5.0 incl. PhotonicVectors plugin (license)
- Documentation/manual
- Type plate present
- Accessories as agreed
- Documentation package (see "Documents" tab)
Not Included
- Installation / commissioning (can be arranged)
- Additional components outside the current configuration (unless explicitly stated in the offer)
Condition & History
| Condition description | Still in operation, R&D-ready, proven parameters (ITO/glass) available. |
|---|---|
| Sale basis | As-is / As-seen |
| Last commissioning | Ongoing operation |
| Usage level | Machine was barely used; very low total operating scope |
| Demo available | Yes, inspection/demo by appointment in Cologne |
Application Fields
The green 532 nm picosecond laser combines the advantages of high absorption in reflective materials with the precision of short wavelengths. Compared to infrared, it offers significantly better coupling into copper and semiconductors; compared to UV, higher available power with good edge quality. Ideal for R&D, prototyping, and small-batch production.
Ready to use immediately
Thin-Film Processing
Selective ablation of thin conductive, semiconductive and insulating layers – isolation scribes, vias and substrate cutting for display, OLED, PV and sensor applications.
Glass Processing
Precision cuts, drills and microfluidic structures in technical glasses. Proven parameter sets for several glass types included.
Ceramic Micromachining
Crack-free cutting, drilling and structuring of technical ceramics with minimal thermal input.
Micro Sieves & Fine Filters
Percussion and galvo trepanning drilling in thin foils and plates (5–100 µm holes).
Surface Roughening & Adhesion Enhancement
Micro-structuring for improved bonding, soldering and hybrid joining joints.
Tribological Micro-Structuring
Dimple and pocket textures on sliding surfaces, bearings and seals for friction reduction.
Tool & Mold Texturing
Surface structuring of injection moulding and embossing tools, mold inserts and cutting edges.
Flexible Electronics & Prototyping
Patterning, cutting and via drilling on flexible substrates for rapid prototyping.
Plastic Processing
Burr-free drilling and cutting for R&D and prototyping.
PMMA, POM: suitable for R&D – UV (355 nm) recommended for series productionAchievable with extension
Nozzle Drilling
Precision drilling for injection, spinning and vent nozzles.
Higher aspect ratios require helical drill head or Z-axis trepanningSiC Dry Machining
Dry structuring and functionalization of silicon carbide without micro-cracks.
Large-area volume removal requires higher laser powerTi Micro-Perforation (PEM Electrolysis)
Micro-drills in thin titanium sheets for PEM electrolyser electrodes.
Series production requires higher throughput and automationWhy this paper – deriving process parameters instead of starting from scratch
Every new application first requires a suitable process parameter set – pulse fluence, repetition rate, spot overlap and scan speed – to be developed. This invited paper provides the scientific data basis for that: systematically measured ablation rates, threshold fluences and HAZ values for more than 25 materials. Buyers can derive their own starting parameters from it instead of beginning characterisation studies entirely from scratch.
For context: the paper was authored by engineers at Coherent Inc. and has no manufacturer relationship to this machine – the machine is made by Pulsar Photonics and the laser source (EdgeWave PX25-2) by EdgeWave. It is relevant purely for its content: with pulse durations from 300 fs to 18 ps at wavelengths of 345 nm, 517 nm and 1035 nm it covers exactly the parameter space of this machine (10 ps, 532 nm).
The 517 nm wavelength used in the paper (frequency-doubled Yb laser, 1035/2 nm) is physically near-identical to the 532 nm laser of this machine – both are "green" ps lasers with the same absorption characteristics in the investigated materials. The published measurements are therefore directly usable as a starting point for parameter development.
Key Findings for 532 nm Picosecond Lasers
1. Ablation Rates at 532 nm for Relevant Materials
The ablation rate describes the material volume removed per minute per Watt of installed laser power [mm³/(W·min)] – the central metric for process speed. At the optimum pulse fluence (≈ e² × threshold fluence), the following maximum values are achieved at ~532 nm (from Hodgson et al., Figs. 9–13):
| Material | Max. Ablation Rate at ≈ 532 nm, ≤ 10 ps | Opt. Fluence [J/cm²] | Notes |
|---|---|---|---|
| Steel | ~ 0.25 mm³/(W·min) | 0.4 – 0.6 | Comparable to IR; better edge quality |
| Aluminium | ~ 0.35 – 0.45 mm³/(W·min) | 0.3 – 0.5 | Highest rate among studied metals |
| Copper | ~ 0.20 – 0.25 mm³/(W·min) | 0.5 – 1.0 | Better coupling than IR due to higher absorption |
| Gold / Brass | ~ 0.25 – 0.35 mm³/(W·min) | 0.5 – 1.0 | Stable processes for precious metals |
| NiTi (Nitinol) | ~ 0.15 – 0.20 mm³/(W·min) | 0.5 – 1.0 | Medical-grade shape-memory alloy |
| Silicon (Si) | ~ 0.25 mm³/(W·min) | 0.5 – 1.0 | Wafer dicing, display applications |
| Silicon Carbide (SiC) | ~ 0.08 – 0.12 mm³/(W·min) | 0.5 – 1.0 | Hard-to-machine material; ablation feasible |
| BK7 / Fused Silica | ~ 0.30 – 0.60 mm³/(W·min) | 2 – 6 | Transparent → higher threshold; 10 ps optimal |
| Sapphire | ~ 0.20 – 0.30 mm³/(W·min) | 2 – 6 | Higher fluence required |
| Kapton (Polyimide) | ~ 2 – 5 mm³/(W·min) | 0.5 – 1.5 | Strongly enhanced at UV; green gives moderate HAZ |
Source: Hodgson et al. (2021), Figs. 9–15. Measured at 517 nm (≈ 532 nm), spot diameter 12–25 µm, 250 kHz repetition rate, 60 % spot overlap.
2. Heat-Affected Zone (HAZ) Analysis
A central finding: for pulse durations below approximately 8–10 ps, the HAZ width is largely independent of pulse duration – 10 ps sits right at this characteristic boundary. The dominant parameter is the applied pulse fluence:
- At optimum fluence (≈ 7.4 × threshold fluence): ablation rate is maximised and HAZ simultaneously minimised
- For metals with 20 µm spot diameter: typical HAZ width 6–8 µm (steel at 345 nm)
- Shorter wavelength (532 nm vs. 1035 nm) enables smaller focus spot → lower absolute HAZ width
- For plastics (Kapton, PET): HAZ strongly dependent on spot size – UV wavelength advantageous for minimum HAZ
3. Process Optimisation: Optimum Fluence & Burst Mode
Maximum ablation rate is achieved at the optimum pulse fluence Fopt = e² × Fth (approximately 7.4× the threshold fluence). The paper identifies three strategies to reach this optimum:
- Double the laser power (at same repetition rate) → +40 % speed, but higher HAZ
- Double both power and repetition rate simultaneously → double speed at same HAZ
- Increase repetition rate to 5–10 MHz (at same power) → optimum fluence, highest efficiency ✓
Alternatively, seeder burst mode (multi-pulse bursts, e.g. 10 pulses at 60 MHz seed frequency) reduces individual pulse energy and shifts the operating point closer to the optimum fluence – without requiring increased galvo scanner speed. Particularly effective for glasses and semiconductors.
4. Industrial Application Examples with 532 nm / 10 ps
The paper documents industrial processes with exactly this machine's parameters (10 ps, 532 nm, ~25 W, 1 MHz) – from Figs. 28–29:
Source: Hodgson et al. (2021), Figs. 27–30.
Data for 25+ materials · Ablation rate charts · HAZ measurements · Application photos · Reference list
Frequently Asked Questions
Yes, an on-site inspection is possible and recommended. Depending on the machine's condition, a demonstration/demo can also be arranged. Please contact us to schedule an appointment.
Alternatively, we can provide extensive photos, videos and documentation if a personal inspection is not possible.
Yes, we generally ship worldwide – in compliance with all applicable export and sanctions regulations. We assist with export documentation (commercial invoice, packing list, certificate of origin if required).
Responsibility for import, customs declaration and country-specific regulations lies with the buyer.
Yes. On request, we take care of delivering the system – from dismantling at its current location and transport through to delivery at your premises. We coordinate logistics and scheduling individually with you.
Maintenance after delivery can also be arranged through us: where required, we facilitate service and maintenance directly via the manufacturer Pulsar Photonics.
Yes. The RDX 500 has a modular design – the laser source, galvanometer scanner and axis system can be exchanged. The values stated in the technical data (e.g. repeatability, laser power, wavelength or repetition rate) refer to the current configuration and do not represent a technical limit – by swapping individual components they can be specifically improved or adapted to your application.
After a conversion, some adjustments by the manufacturer Pulsar Photonics may be required (e.g. calibration and software integration of the new component). In our experience these remain limited. Contact us – we are happy to coordinate the desired configuration with you and the manufacturer.
Yes, suitable tool parameter sets can be developed for your specific application. The work can be carried out either directly through the manufacturer Pulsar Photonics or through one of our partners.
Typical application fields for which parameter sets can be developed with the 532 nm picosecond laser include:
- Micro sieves & nozzles – precision drilling in metal and ceramics
- Ultra-fine drillings (micro-drills)
- Nano-structuring of surfaces
- Surface roughening & friction minimization
- Pin structures in wafer chucks
- Precision shafts with herringbone structure
- Tool engineering (e.g., cutting edges, micro-geometries)
- Thin-film processing
- High-contrast markings & emissivity modification
Contact us – we are happy to clarify whether your application is feasible with the available wavelength and power.
Interested in the Pulsar Photonics RDX 500?
Request an individual quote or arrange an inspection appointment.
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