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Pulsar Photonics RDX 500

Used USP picosecond laser system for industrial micromachining

For Sale Condition: Used · operational · barely used Pre-owned price: on request
● For Sale
Condition
Used – operational
Usage level
Very low (barely used)
Demo available
Yes – Cologne, by appointment
Sale basis
As-is / As-seen
Pre-owned price
On Request
Technical Highlights
Laser type
USP picosecond
Wavelength
532 nm (green)
Pulse duration
10 ps
Power
< 20 W
Laser class
Class 1
Weight
approx. 750 kg

Key Technical Data

Laser Type Ultra-short pulse laser (USP / Picosecond)
Pulse Duration 10 ps
Wavelength 532 nm
Average Power < 20 W
Repetition Rate 100 kHz – 20 MHz
Laser Serial Number SN0702
Machine Serial Number RDX-500-071501
Processing Axes 2.5 axes (X/Y processing + Z-axis for focus/depth adjustment)
Scanner Unit 2D galvanometer scanner with Newson rhothor™ Controller A2G_CUA01 incl. F-Theta objective; optical scan range 800 mrad
Processing Area Min. 210 mm × 290 mm (exact dimensions to be specified)
Control Software Windows 7 with Photonic Elements (scanner, camera, laser, axes control; CAD-CAM import, live view) and Rhinoceros 5.0 incl. PhotonicVectors plugin for job preparation
CAM Software Rhinoceros 5.0 incl. PhotonicVectors plugin
Voltage / Electrical Power 400 V, 5.8 kW
Dimensions (L×W×H) 1,500 × 1,200 × 1,850 mm
Transport Note The system likely fits through a 1.0 m wide door when partially disassembled.
Weight approx. 750 kg
Laser Class Safety class 1

Available Documents

Scope of Delivery

The exact scope of delivery will be confirmed in writing before sale. Subject to change.
  • Laser system Pulsar Photonics RDX 500 (base machine)
  • Laser source EdgeWave PX25-2
  • Control PC with software
  • 2D galvanometer scanner unit with Newson scanner controller A2G_CUA01 incl. F-Theta objective
  • Pulsar Photonics Camera Module CM-R1 for workpiece positioning
  • Camera-based measurement function (for position and reference measurement)
  • 1 tool parameter set for ITO thin-film ablation
  • 1 tool parameter set for glass cutting
  • Additional tool parameter sets can be developed on request
  • Exhaust/suction device for ablation particles
  • Vacuum chuck with vacuum pump for flat sample fixation
  • CAM software: Rhinoceros 5.0 incl. PhotonicVectors plugin (license)
  • Documentation/manual
  • Type plate present
  • Accessories as agreed
  • Documentation package (see "Documents" tab)

Not Included

  • Installation / commissioning (can be arranged)
  • Additional components outside the current configuration (unless explicitly stated in the offer)

Condition & History

Condition description Still in operation, R&D-ready, proven parameters (ITO/glass) available.
Sale basis As-is / As-seen
Last commissioning Ongoing operation
Usage level Machine was barely used; very low total operating scope
Demo available Yes, inspection/demo by appointment in Cologne
Notice: The machine is sold on an "as-is / as-seen" basis. An on-site inspection is recommended. See our Terms & Conditions for details.

Application Fields

The green 532 nm picosecond laser combines the advantages of high absorption in reflective materials with the precision of short wavelengths. Compared to infrared, it offers significantly better coupling into copper and semiconductors; compared to UV, higher available power with good edge quality. Ideal for R&D, prototyping, and small-batch production.

Ready to use immediately

Thin-Film Processing

Selective ablation of thin conductive, semiconductive and insulating layers – isolation scribes, vias and substrate cutting for display, OLED, PV and sensor applications.

ITO ✓ AZO TCO Metallic thin films

Glass Processing

Precision cuts, drills and microfluidic structures in technical glasses. Proven parameter sets for several glass types included.

Borosilicate ✓ Eagle XG ✓ Fused silica ✓ Glass cutting 1.5 mm ✓ Soda-lime glass Sapphire

Ceramic Micromachining

Crack-free cutting, drilling and structuring of technical ceramics with minimal thermal input.

PZT-5A ✓ Al₂O₃ ZrO₂ AlN

Micro Sieves & Fine Filters

Percussion and galvo trepanning drilling in thin foils and plates (5–100 µm holes).

Stainless steel Titanium Copper Ceramics

Surface Roughening & Adhesion Enhancement

Micro-structuring for improved bonding, soldering and hybrid joining joints.

Stainless steel Copper Nickel Ceramics

Tribological Micro-Structuring

Dimple and pocket textures on sliding surfaces, bearings and seals for friction reduction.

Stainless steel Titanium Ceramics (Si₃N₄, SiC)

Tool & Mold Texturing

Surface structuring of injection moulding and embossing tools, mold inserts and cutting edges.

Tool steel Mold inserts

Flexible Electronics & Prototyping

Patterning, cutting and via drilling on flexible substrates for rapid prototyping.

Polyimide (Kapton) PET FR-4 / ABF

Plastic Processing

Burr-free drilling and cutting for R&D and prototyping.

Polyimide PET FR-4 PMMA
PMMA, POM: suitable for R&D – UV (355 nm) recommended for series production

Achievable with extension

Nozzle Drilling

Precision drilling for injection, spinning and vent nozzles.

Metals Ceramics
Higher aspect ratios require helical drill head or Z-axis trepanning

SiC Dry Machining

Dry structuring and functionalization of silicon carbide without micro-cracks.

SSiC RSiC SiSiC
Large-area volume removal requires higher laser power

Ti Micro-Perforation (PEM Electrolysis)

Micro-drills in thin titanium sheets for PEM electrolyser electrodes.

Titanium
Series production requires higher throughput and automation
Note: Suitability statements are based on technical literature and manufacturer data and do not constitute a binding guarantee. Contact us for an individual feasibility assessment.
Included in delivery: Tested parameter sets for ITO thin-film ablation, glass cutting (d = 1.5 mm), PZT cutting, and proven parameters for borosilicate, Eagle XG and fused silica.

Frequently Asked Questions

Yes, an on-site inspection is possible and recommended. Depending on the machine's condition, a demonstration/demo can also be arranged. Please contact us to schedule an appointment.

Alternatively, we can provide extensive photos, videos and documentation if a personal inspection is not possible.

Yes, we generally ship worldwide – in compliance with all applicable export and sanctions regulations. We assist with export documentation (commercial invoice, packing list, certificate of origin if required).

Responsibility for import, customs declaration and country-specific regulations lies with the buyer.

Yes, suitable tool parameter sets can be developed for your specific application. The work can be carried out either directly through the manufacturer Pulsar Photonics or through one of our partners.

Typical application fields for which parameter sets can be developed with the 532 nm picosecond laser include:

  • Micro sieves & nozzles – precision drilling in metal and ceramics
  • Ultra-fine drillings (micro-drills)
  • Nano-structuring of surfaces
  • Surface roughening & friction minimization
  • Pin structures in wafer chucks
  • Precision shafts with herringbone structure
  • Tool engineering (e.g., cutting edges, micro-geometries)
  • Thin-film processing
  • High-contrast markings & emissivity modification

Contact us – we are happy to clarify whether your application is feasible with the available wavelength and power.

Interested in the Pulsar Photonics RDX 500?

Request an individual quote or arrange an inspection appointment.

Send Email Call: +49 151 27024251