Frequently Asked Questions (FAQ)

Yes, an on-site inspection is possible and recommended. Depending on the machine's condition, a demonstration/demo can also be arranged. Please contact us to schedule an appointment.

Alternatively, we can provide extensive photos, videos and documentation if a personal inspection is not possible.

Yes, we generally ship worldwide – in compliance with all applicable export and sanctions regulations. We assist with export documentation (commercial invoice, packing list, certificate of origin if required).

Responsibility for import, customs declaration and country-specific regulations lies with the buyer.

Yes. On request, we take care of delivering the system – from dismantling at its current location and transport through to delivery at your premises. We coordinate logistics and scheduling individually with you.

Maintenance after delivery can also be arranged through us: where required, we facilitate service and maintenance directly via the manufacturer Pulsar Photonics.

Yes. The RDX 500 has a modular design – the laser source, galvanometer scanner and axis system can be exchanged. The values stated in the technical data (e.g. repeatability, laser power, wavelength or repetition rate) refer to the current configuration and do not represent a technical limit – by swapping individual components they can be specifically improved or adapted to your application.

After a conversion, some adjustments by the manufacturer Pulsar Photonics may be required (e.g. calibration and software integration of the new component). In our experience these remain limited. Contact us – we are happy to coordinate the desired configuration with you and the manufacturer.

Yes, suitable tool parameter sets can be developed for your specific application. The work can be carried out either directly through the manufacturer Pulsar Photonics or through one of our partners.

Typical application fields for which parameter sets can be developed with the 532 nm picosecond laser include:

• Micro sieves & nozzles – precision drilling in metal and ceramics
• Ultra-fine drillings (micro-drills)
• Nano-structuring of surfaces
• Surface roughening & friction minimization
• Pin structures in wafer chucks
• Precision shafts with herringbone structure
• Tool engineering (e.g., cutting edges, micro-geometries)
• Thin-film processing
• High-contrast markings & emissivity modification

Contact us – we are happy to clarify whether your application is feasible with the available wavelength and power.